Chotest Wd4000 Series, Image-Free Wafer Geometry Measurement System

• Customization: Available
• After-sales Service: Online Support/Service at Customer Site
• Application: Machinery, Electronics
• Model NO.: WD4000
• Certification: GS, CE, RoHS, ISO
• Condition: New
• Performance Classification: Economical
• Transport Package: Wooden Crates/Sea Packaging
• Specification: presently inquiring
• Trademark: CHOTEST
• Origin: China
• HS Code: 9031499090
• Production Capacity: 2000PCS/Year
• Package Size: 76.00cm * 122.00cm * 167.00cm
• Package Gross Weight: 600.000kg

Product Description

Company Profile

Product Description

CHOTEST WD4000 Series, Image-Free Wafer Geometry Measurement System
The WD4000 non-graphic wafer geometry measurement system can automatically measure wafer thickness, surface roughness, and micro and nano three-dimensional morphology in one measurement system.Using spectral confocal technology to measure wafer thickness, TTV, LTV, BOW, WARP, line roughness and other parameters, and at the same time to generate Mapping diagrams; non-contact scanning of the Wafer surface using white light interferometry technology at the same time to establish the surface of the 3D laminar analysis of the image, displaying 2D cross-section and 3D three-dimensional color view, and efficiently analyze the surface morphology, roughness, and the related 2D and 3D parameters.parameters.
The WD4000 wafer geometry measurement system can be widely used in substrate manufacturing, wafer manufacturing, and packaging process inspection, 3C electronic glass screen and its precision parts, optical processing, display panels, MEMS devices and other ultra-precision processing industry.It can measure all kinds of surfaces from smooth to rough, low reflectivity to high reflectivity, thickness, roughness, flatness, micro-geometric contour, curvature, etc., from nano-micron level workpieces, and provide a total of more than 300 kinds of 2D and 3D parameters based on the four major domestic and international standards, such as ISO/ASME/EUR/GBT, as the evaluation standard.

Our Advantages

Measurement of thickness and warpage of wafers without picture

Through non-contact measurement, the three-dimensional shape of the wafer is reconstructed, and the powerful measurement and analysis software stabilizes the calculation of wafer thickness, TTV, BOW, WARP, and effectively prevents scratches and defects on wafers while efficiently measuring and measuring.
 
3D images of the wafer surface after rough and fine grinding in the wafer thinning process, the size of the surface roughness Sa value and the stability of the value in multiple measurements are used to feedback the processing quality.The roughness of finely ground wafers is concentrated around 5 nm, and the repeatability is 0.046987 nm with 25 measurements, which is a good measurement stability, measured in the noisy environment of the production workshop.

Product Parameters

 

Parameter	WD4100	WD4200
Model	WD4100	WD4200
Measurement System	Thickness and Warpage Measurement System	Thickness and Warpage Measurement System
Measurable Materials	Gallium Arsenide, Gallium Nitride, Gallium Phosphide, Germanium, Indium Phosphide, Lithium Niobate, Sapphire, Silicon, Silicon Carbide, Glass, etc.	Gallium Arsenide, Gallium Nitride, Gallium Phosphide, Germanium, Indium Phosphide, Lithium Niobate, Sapphire, Silicon, Silicon Carbide, Glass, etc.
Measurement Sensor	High - precision Spectroscopic Displacement Sensor	High - precision Spectroscopic Displacement Sensor
Measurement Range	150μm - 2000μm	150μm - 2000μm
Scanning Mode	Fullmap Area Scan, Cross Scan, Free Multi - point Scan	Fullmap Area Scan, Cross Scan, Free Multi - point Scan
Measurement Accuracy	±0.25μm	±0.25μm
Repeatability (σ)	0.2μm	0.2μm
Probe Resolution	17nm	17nm
Measurement Parameters	THK, TTV, LTV, BOW, WARP, SORI, TIR, STRESS, etc.	THK, TTV, LTV, BOW, WARP, SORI, TIR, STRESS, etc.
Profile Measurement System	3D Microscopic Profile Measurement System	3D Microscopic Profile Measurement System
Measurement Principle	-	White - light Interference
Light Source	-	White - light LED
Interference Objective	-	10× (2.5×, 5×, 20×, 50×, multiple optional)
*Measurement Field of View 1	-	0.96 mm×0.96 mm
Objective Turret	-	3 - hole Manual (5 - hole Electric Optional)
Z - axis Scanning Range	-	10 mm
Z - axis Resolution	-	EVSI: 0.5nm ; EPSI: 0.1nm
Lateral Resolution	-	0.5 - 3.7μm
Scanning Speed	-	2.5 - 5.0μm/s
Measurable Sample Reflectivity	-	0.05% - 100%
*Roughness RMS Repeatability 2	-	0.01nm
Step Measurement - Accuracy	-	0.50%
Step Measurement - Repeatability	-	0.1% 1σ
Measurement Parameters	-	Three major categories of parameters: Microscopic profile, line/area roughness, spatial frequency, etc.
System Specifications
Wafer Size	4", 6", 8", 12"	4", 6", 8", 12"
Wafer Chuck	Anti - static Electrostatic Vacuum Chuck	Anti - static Electrostatic Vacuum Chuck
XYZ Worktable Stroke	400mm/400mm/75mm	400mm/400mm/75mm
Maximum Movement Speed	500mm/s	500mm/s
Worktable Body	Marble	Marble
Vibration Isolation Platform	Passive Vibration - isolating Air Cushion	Passive Vibration - isolating Air Cushion
Worktable Load	≤3kg	≤3kg
Overall Dimensions	1500×1500×2000mm	1500×1500×2000mm
Total Weight	Approximately 1500kg	Approximately 1500kg
Air Source Requirements	0.6MPa; 60L/min	0.6MPa; 60L/min
Temperature Requirements	Temperature 20°C ± 1°C / Relative humidity 30 - 80%	Temperature 20°C ± 1°C / Relative humidity 30 - 80%
Vibration Requirements	V - c	V - c

Certifications

Packaging & Shipping